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August 2003

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Subject:
From:
Rudy Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Aug 2003 10:04:46 EDT
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In a message dated 8.8.03 4:30:22 AM Pacific Daylight Time,
[log in to unmask] writes:


> What is the best etchant to use for small scale high density copper
> nickel gold pattern plating line?
>

Not trying to be "a wisea...", but what you mean by "best" etchant?  Suspect
you may be limited to ammoniacal because of exposed Nickle on edges.

Rudy Sedlak
RD Chemical Company

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