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Mon, 15 Sep 1997 10:18:47 -0500 |
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In a small pcb shop, our process is a Plasma etch, Shadow (graphite),
followed by copper plating, then gold pattern plating over copper (no
nickel) and then etch. Processes work well for all teflon type matls except
4003 which is ceramic filled. Large voids in pth is biggest problem (but
only in some batches). If anyone has a process that works well and would be
willing to share it, or comments on these processes, I would appreciate the
assistance. Please reply direct.
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