In a small pcb shop, our process is a Plasma etch, Shadow (graphite), followed by copper plating, then gold pattern plating over copper (no nickel) and then etch. Processes work well for all teflon type matls except 4003 which is ceramic filled. Large voids in pth is biggest problem (but only in some batches). If anyone has a process that works well and would be willing to share it, or comments on these processes, I would appreciate the assistance. Please reply direct. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################