 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0u4VBy-00008nC; Wed, 3 Apr 96 10:13 CST |
| From [log in to unmask] Wed Apr 3 17: |
51:15 1996 |
| Old-Return-Path: |
|
| Date: |
Wed, 3 Apr 1996 10:25:52 -0600 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"haqWp2.0.W7E.1FgOn"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
In soldering with lead-based solders (i.e. HMP, >90%Pb) is it
essential to pretin the components lead with a high Pb alloy for
component leads that are Sn85/Pb15 or Sn80/Pb20 plated, Sn60/Pb40 or
Sn63/Pb37 coated, and what about gold-plated?
What are the pro's/con's of not pretinning, undestanding the
propensity of leads (Pb) and tins (Sn) to lower the melting
points..How much I am not sure ! Is there a distinct advantage OF
pretinning with Pb ?
One other note, the storage temps will be greater than 190degC.
Thanks
Darrell
|
|
|
