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| From [log in to unmask] Mon Feb 26 12: |
39:47 1996 |
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Jay Brusse at Unisys asked for info on bonding solder terminated chip caps with
silver conductive adhesive as gold terminated components are hard to find.
I would be interested to see comments on Jay's problem and also on the
following:
Palladium silver terminations are usually a standard alternative finish on
components of this nature, and are compatible with silver conductives. In fact
solder finished devices are derived from the Pd/Ag types by coating them with
solder (over a nickel barrier layer), so it might be easier to get them as
"specials". ie leaving out a couple of processes rather than doing an
additional/alternative as would be the case with gold.
Has the Pd/Ag finish already been rejected for some reason? eg fears of Ag
migration......
Mike Fenner
BSP, UK
100760,[log in to unmask]
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