Jay Brusse at Unisys asked for info on bonding solder terminated chip caps with silver conductive adhesive as gold terminated components are hard to find. I would be interested to see comments on Jay's problem and also on the following: Palladium silver terminations are usually a standard alternative finish on components of this nature, and are compatible with silver conductives. In fact solder finished devices are derived from the Pd/Ag types by coating them with solder (over a nickel barrier layer), so it might be easier to get them as "specials". ie leaving out a couple of processes rather than doing an additional/alternative as would be the case with gold. Has the Pd/Ag finish already been rejected for some reason? eg fears of Ag migration...... Mike Fenner BSP, UK 100760,[log in to unmask]