Hello all,
I need to find requirements which specify lead tinning requirements.
We have a supplier which is performing a lead tinning process called "DIP-N-SPIN". Is anyone using this process? The device is dipped and then spun at 2000RPM. This process leaves a very thin layer of tin/lead on the leads. Measured data shows 20micro-inches, this is over Kovar leads. Seems I remember 300 micro-inches from some document. We're having problems with solderability and fractured solder joints. IPC or MIL standards would be great.
Thanks in advance,
Randy

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