Hello all, I need to find requirements which specify lead tinning requirements. We have a supplier which is performing a lead tinning process called "DIP-N-SPIN". Is anyone using this process? The device is dipped and then spun at 2000RPM. This process leaves a very thin layer of tin/lead on the leads. Measured data shows 20micro-inches, this is over Kovar leads. Seems I remember 300 micro-inches from some document. We're having problems with solderability and fractured solder joints. IPC or MIL standards would be great. Thanks in advance, Randy --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------