Subject: | |
From: | |
Reply To: | |
Date: | Thu, 16 Oct 2008 08:39:11 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
what's in the way of having them filled w/ non-conductive epoxy after
via plating but prior to final surface finish?
dw
At 07:35 AM 10/16/2008, Dave Connitt wrote:
>Hi Pete,
>This is a research/development project. The vias are currently tented,
>plus some are under a couple of 100 pin QFP's. I would have to move the
>vias out from under the FPGA's or risk solder balls once I untented
>them. Since this is a development project, I doubt they will spin the
>board again unless there is some other issue. We rarely wave solder
>boards anymore as there are very few thru hole parts on them anymore.
>The wave was a great way to fill vias with solder. Ah, the good old
>days..
>Dave Connitt CID+
>Printed Circuit Designer
>KDI Precision Products, Inc.
>A Wholly Owned Subsidiary of:
>L3 Communications
>3975 McMann Road
>Cincinnati, Ohio 45245
>Ph. 513- 943-2010 Fax 513-943-2288
>
>
>-----Original Message-----
>From: Pete Houwen [mailto:[log in to unmask]]
>Sent: Thursday, October 16, 2008 9:36 AM
>To: [log in to unmask]; Connitt, Dave @ KDI
>Subject: Re: Problems with plating vias closed
>
>Is this just a matter of closing the holes? Rather than having your PCB
>supplier try to plate the holes full, can you let them (partially) fill
>during soldering?
>
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 15.0
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to
>[log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to
>[log in to unmask]: SET Technet Digest
>Search the archives of previous posts at: http://listserv.ipc.org/archives
>Please visit IPC web site
>http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
>information, or contact Keach Sasamori at [log in to unmask] or
>847-615-7100 ext.2815
>-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|