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| From [log in to unmask] Wed Apr 3 16: |
47:51 1996 |
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Our HASL solder thickness spec. is 0.3 to 1.5 mils. Is it unreasonable
to expect using a horizontal HASL process that 1.5 mils will be the actual
max. on 100% of the pads on both sides of the board, even with fine pitch (<
= 20 mils)?
My guess is that the surface tension of the molten solder on the fine
pitch pads, its low mass and the surrounding geography, make it difficult
for the air knives to do consistant leveling.
Some of our product mix here is Mil Spec work. Converting the boards
with fine pitch on both sides to Au/Ni may be more pain than it is worth.
Any inputs on this subject will be greatly appreciated.
Norm Dill
MQC Specialist
[log in to unmask]
(716) 242-4210
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