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| From [log in to unmask] Sat Apr 27 14: |
37:42 1996 |
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Does anyone have any experiences or commemts on converting DIL components to a surface mounting which they can share with me? Our current in house workmanship standards donot allow butt joint solder joints. I have noted that in IPC SM 780 it talks about forming these parts to a SOIC leadform shape. I would appreciate any information on footprint/ landpad design, leadform profiles and solder joint reliability that anybody can send to me.
Regards
Neil Sellars
Principal Engineer
Radstone Technology PLC
UK
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