Does anyone have any experiences or commemts on converting DIL components to a surface mounting which they can share with me? Our current in house workmanship standards donot allow butt joint solder joints. I have noted that in IPC SM 780 it talks about forming these parts to a SOIC leadform shape. I would appreciate any information on footprint/ landpad design, leadform profiles and solder joint reliability that anybody can send to me. Regards Neil Sellars Principal Engineer Radstone Technology PLC UK