Careful: J-STD-003 section 3.5.1 The bulk temperature of the solder bath
shall be maintained at 245°C + 5°C [473°F + 9°F] unless another temperatuer
is agreed to by the vendor and user.


Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290


  -----Original Message-----
  From: TechNet [mailto:[log in to unmask]]On Behalf Of Timothy Reeves
  Sent: Monday, August 20, 2001 2:36 PM
  To: [log in to unmask]
  Subject: Re: [TN] Solder Testing


  This test should also be done at 500 deg F, not 480.
  T Reeves
    -----Original Message-----
    From: Guy Ramsey [mailto:[log in to unmask]]
    Sent: Monday, August 20, 2001 9:42 AM
    Subject: Re: Solder Testing


    J-STD-003   4.2.3.4.1 After fluxing and draining per  . . . slide the
coupon gently on molten solder. Allow coupon to float on solder for 5
seconds maximum. The coupon may be depressed into the solder bath to a
maximum of 50% of the coupon thickness after it has been initially floated
on the solder. After the elapsed time, slide the coupon off molten solder.
Hold coupon still and horizontal until solder solidifies.

    Guy Ramsey
    Senior Lab Technician / Instructor


    E-Mail: [log in to unmask]
    Ph: (610) 362-1200 x107
    Fax: (610) 362-1290


      -----Original Message-----
      From: TechNet [mailto:[log in to unmask]]On Behalf Of Michael Lester
      Sent: Monday, August 20, 2001 11:05 AM
      To: [log in to unmask]
      Subject: [TN] Solder Testing


      Can someone tell me if there is a standard dwell time in a solder
float test?
      2 inch square coupon using Kester Non-Activated flux,temperature of
480º
      Thanks for the help.