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| >From willli Fri Aug 1 10: |
04:31 1997 |
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| From [log in to unmask] Fri Aug 8 13: |
59:47 1997 |
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I can think of three processes that have been successful for us:
1) Cu/Ni/Au on circuit board, silver filled epoxy for die mount.
2) Thickfilm Au and Ag connection on hybrid microcircuit.
3) My wife's wedding ring.
I'm sure there are other processes. Can your source point you (or me) to any
supporting documentation?
Glenn Pelkey
Quality/Reliability Engineer
Maxtek Components Corp.
"Murphy Steve (UO/ESS)" <[log in to unmask]> Wrote:
|
| I have been told that gold and silver are incompatible
| materials forbonding together, and that, therefore, gold
| finishes and silver-filled,electrically conductive
| adhesives will not work well together. Doesanyone have
| any data to corroborate or contradict this
| information?Steve
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