Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 11 May 2000 09:54:29 +0200 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Martin,
its always the same component and the solderjoint looks like it is reflowed
again.
thanks
> -----Oorspronkelijk bericht-----
> Van: TechNet [mailto:[log in to unmask]]namens Martin Christie
> Verzonden: woensdag 10 mei 2000 13:35
> Aan: [log in to unmask]
> Onderwerp: Re: [TN] loose components
>
>
> Lon,
>
> What do the failed solder joints look like? i.e. do they look
> like they have
> suffered mechanical damage or have they gone through another
> reflow perhaps.
>
> Is it always the same component that fails?
>
> Martin
>
> ===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
> 10/05/00 12:02
> >Hi,
> >
> >Is one of you technetters familiar with this problem:
> >
> >For a customer we produce a board (3 by 5 centimeters)with no more then 6
> >smt components 1206. When they encapsule the board with a compound one of
> >the components looses from the board. They put the compound on the board
> >with 30-40 bar pressure and 150deg celsius temperature. It seems
> to me that
> >the preesure causes a higher temperature then 150 deg.
> >The customer says the soldering joints are bad , but we can't find any
> >solderingproblems at all.
> >
> >Thanks in advance
> >
> >Lon Weffers
> >Matas Electronics bv
> >De Dieze 16
> >5684PT Best The Netherlands
> >www.matas.nl
> >
> >##############################################################
> >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> >##############################################################
> >To subscribe/unsubscribe, send a message to [log in to unmask]
> with following text in
> >the body:
> >To subscribe: SUBSCRIBE TECHNET <your full name>
> >To unsubscribe: SIGNOFF TECHNET
> >##############################################################
> >Please visit IPC web site (http://www.ipc.org/html/forum.htm)
> for additional
> >information.
> >If you need assistance - contact Keach Sasamori at [log in to unmask] or
> >847-509-9700 ext.5315
> >##############################################################
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in
> the body:
> To subscribe: SUBSCRIBE TECHNET <your full name>
> To unsubscribe: SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ##############################################################
>
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
##############################################################
|
|
|