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November 2002

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TechNet <[log in to unmask]>
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Date:
Wed, 27 Nov 2002 15:01:33 EST
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
Re: SMT component packaging specifications
From:
"Norman S. Robinson" <[log in to unmask]>
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