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July 1998

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TechNet <[log in to unmask]>
Subject:
Reliability, thermal and electrical modeling for BGAs
From:
Yuan Li <[log in to unmask]>
Date:
Wed, 22 Jul 1998 16:41:02 -0700
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Yuan Li <[log in to unmask]>
Parts/Attachments:
text/plain (27 lines) 
Dear Technetters,

I am gathering information on modeling services/consultancy on electronic
packages mainly PBGAs, flip chips etc. for future collaborations with my
company. If you provide these services or can refer someone, please let me
know. It is preferred that a web address be provided if available.

Regards,

Yuan Li
Packaging Engineer
Altera Corp.
(408)544-7508
Fax (408) 544-6419

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