Dear Technetters, I am gathering information on modeling services/consultancy on electronic packages mainly PBGAs, flip chips etc. for future collaborations with my company. If you provide these services or can refer someone, please let me know. It is preferred that a web address be provided if available. Regards, Yuan Li Packaging Engineer Altera Corp. (408)544-7508 Fax (408) 544-6419 ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################