Hello Louis,

Measurements of bump heights on the order of hundreds of microns can be done with a couple of different methods.  An extremely sensitive method is profilometry.  This method uses a stylus to move over the surface and determines roughness through the z-axis movement of the stylus.  Profilometry is typically accurate below micron levels.  

Oxford Instruments produces a number of gauges designed to measure copper thickness using techniques like electrical resistance and eddy current.  These are not as accurate as profilometry, and require a larger spot size for measurement.  


Best regards,
Tony Lentz


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis Hart
Sent: Friday, May 15, 2015 11:24 AM
To: [log in to unmask]
Subject: [TN] measuring bump heights

Technetters, how can one measure solder or copper bump heights on an IC or PC board?  Heights and spacings I am interested in are in the range of 100-200 microns and 300-400 microns, respectively.

Thanks for any help.

Maybe someone in the foil business is on technet. At EXPO, there have been discussions of foil roughness measurement techniques.  My problem is, I think, an easy one by comparison.   Louis Hart

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________