Hello Louis, Measurements of bump heights on the order of hundreds of microns can be done with a couple of different methods. An extremely sensitive method is profilometry. This method uses a stylus to move over the surface and determines roughness through the z-axis movement of the stylus. Profilometry is typically accurate below micron levels. Oxford Instruments produces a number of gauges designed to measure copper thickness using techniques like electrical resistance and eddy current. These are not as accurate as profilometry, and require a larger spot size for measurement. Best regards, Tony Lentz -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Louis Hart Sent: Friday, May 15, 2015 11:24 AM To: [log in to unmask] Subject: [TN] measuring bump heights Technetters, how can one measure solder or copper bump heights on an IC or PC board? Heights and spacings I am interested in are in the range of 100-200 microns and 300-400 microns, respectively. Thanks for any help. Maybe someone in the foil business is on technet. At EXPO, there have been discussions of foil roughness measurement techniques. My problem is, I think, an easy one by comparison. Louis Hart ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________