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October 1999

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Date:
Fri, 8 Oct 1999 13:46:57 EDT
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Werner Engelmaier <[log in to unmask]>
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Hi Michael,
Be careful about dummy components--don NOT use any that do not have chips in
them. The chips in many cases dominate the thermal expansion response of the
components, and without them you totally wrong answers in any test.
It is too bad that you did not e-mail 2 weeks earlier; I just gave a 2-day
workshop to the Nokia people right in the DaimlerChrysler compound on
Eselsberg, and we could perhaps have talked about your needs.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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