Hi Michael, Be careful about dummy components--don NOT use any that do not have chips in them. The chips in many cases dominate the thermal expansion response of the components, and without them you totally wrong answers in any test. It is too bad that you did not e-mail 2 weeks earlier; I just gave a 2-day workshop to the Nokia people right in the DaimlerChrysler compound on Eselsberg, and we could perhaps have talked about your needs. Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 904-437-8747, Fax: 904-437-8737 E-mail: [log in to unmask], Website: www.engelmaier.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################