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| From [log in to unmask] Wed Sep 25 11: |
45:50 1996 |
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We are currently establishing our BGA process and have several
questions:
1. What is an acceptable amount of times a BGA device can be
reworked, reballed, and remounted?
2. What are the critical elements to consider and why?
3. What is the maximum number or percentage of solder voids allowed
per solder joint (bump) connection?
4. Has IPC released a BGA standard?
Tim Mendenhall (QA)
Hitachi
Email: [log in to unmask]
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