We are currently establishing our BGA process and have several questions: 1. What is an acceptable amount of times a BGA device can be reworked, reballed, and remounted? 2. What are the critical elements to consider and why? 3. What is the maximum number or percentage of solder voids allowed per solder joint (bump) connection? 4. Has IPC released a BGA standard? Tim Mendenhall (QA) Hitachi Email: [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************