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Mon, 26 Jul 1999 15:08:58 -0400 |
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hmmmm.... good question. and I have no clue as to reliability. I wonder why
someone would do that in the first place unless it was reworking a mistake.
This is a new one on me.
Ed Cosper
-----Original Message-----
From: [log in to unmask] <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, July 26, 1999 1:12 PM
Subject: [TN] NI/AU UNDER BETWEEN COPPER
>I just looked at a product where the manufacturer has managed to
>overplate nickel/gold with copper. This occurs on the surface conductors
>and also in holes.
>
>I have looked in the design and board documents, but cannot find anything
>that addresses the reliability of such a condition. I know putting a
>"meltable"
>material between layers of copper can wreak havoc, but what about
>ni/au?
>
>Susan Mansilla
>Robisan Lab
>
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