We will be assembling National's BPA05 package.  It is a very small BGA like device.  The component dimensions are 1.1mm x 0.93 mm x .85 mm tall with 5 - 0.14 mm diameter eutectic solder balls at 0.5 mm pitch.  (Picture 2- 0402 caps fused together with tiny solder balls underneath).  http://www.national.com/packaging/mkt/bpa05xxx.pdf

The pads on the board are 0.15mm (6 mils) in diameter.

My main concern is screen printing.  I was planning on using a 4 mil thick laser cut stencil with 6 or 7 square shaped apertures.  I will be using a Type 4 paste.

If I can't get decent printing, I would alternatively use a tacky flux at those locations.

I'm pretty sure that I can get my pick and place machine to recognize the part and reflow should be no problem.

Has anyone had any experience with this device?

Thanks
Peter

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Silicon Forest Electronics, Inc.
6204 East 18th  St
Vancouver WA
98661
360.694.2000 (phone)
360.737.3181 (fax)
www.si-forest.com
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