Subject: | |
From: | |
Reply To: | |
Date: | Thu, 3 Sep 1998 11:36:53 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Mornin' all-
Is there an IPC spec which relates to how large, location, etc. of
solder balls that are located around, under, near components. I realize
this signifies a process error, and I think I have solved it. However,
I am still curious if IPC regulates this or not.
Ryan Jennens
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|