Mornin' all- Is there an IPC spec which relates to how large, location, etc. of solder balls that are located around, under, near components. I realize this signifies a process error, and I think I have solved it. However, I am still curious if IPC regulates this or not. Ryan Jennens ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################