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IPC 2nd International Conference on Flexible Circuits,
Chip Scale and Bare Die Packaging
Educational Courses: January 6, 2004
Technical Conference and Tabletop Exhibits: January 7-8, 2004
Fiesta Inn ? Tempe, AZ
Which new flexible circuits, chip scale or bare die packaging technology is your company exploring or developing? Share your experiences and challenges. The industry is willing to listen. You're invited to send in your presentation abstract or workshop proposal to Alexandra Curtis at Alexandra [log in to unmask]
The November 26th deadline is rapidly approaching and slots in the conference program agenda are filling up quick.
Topics are being sought in the following areas:
CSP Standards Progress
Wafer Level CSP
CSP Design
CSP Die Attach
CSP Solder Joint Reliability
Flex Processing Innovations
Flex Assembly
Flex Market Trends
Non-CSP Flex Applications
Flex Test and Reliability
Flex HDI for CSP Applications
CSPs in Three Dimension
Flex and CSP Materials
Design for CSPs on Flex
Flex with CSP Yields
Flip Chip Development
Flex and Lead Free
Advanced Packaging
The International Conference on Flexible Circuits, Chip Scale and Bare Die Packaging offers presentation time slots between 30-45 minutes. The presentation must be of a non-commercial nature, focusing on the technology rather than serving as an advertisement for a company's product.
Showcase your company's products and services to a highly qualified audience by signing up for a tabletop or sponsorship opportunity TODAY!
You'll find all the information you need at www.ipc.org/FlexNChips.
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