IPC 2nd International Conference on Flexible Circuits, Chip Scale and Bare Die Packaging Educational Courses: January 6, 2004 Technical Conference and Tabletop Exhibits: January 7-8, 2004 Fiesta Inn ? Tempe, AZ Which new flexible circuits, chip scale or bare die packaging technology is your company exploring or developing? Share your experiences and challenges. The industry is willing to listen. You're invited to send in your presentation abstract or workshop proposal to Alexandra Curtis at Alexandra [log in to unmask] The November 26th deadline is rapidly approaching and slots in the conference program agenda are filling up quick. Topics are being sought in the following areas: CSP Standards Progress Wafer Level CSP CSP Design CSP Die Attach CSP Solder Joint Reliability Flex Processing Innovations Flex Assembly Flex Market Trends Non-CSP Flex Applications Flex Test and Reliability Flex HDI for CSP Applications CSPs in Three Dimension Flex and CSP Materials Design for CSPs on Flex Flex with CSP Yields Flip Chip Development Flex and Lead Free Advanced Packaging The International Conference on Flexible Circuits, Chip Scale and Bare Die Packaging offers presentation time slots between 30-45 minutes. The presentation must be of a non-commercial nature, focusing on the technology rather than serving as an advertisement for a company's product. Showcase your company's products and services to a highly qualified audience by signing up for a tabletop or sponsorship opportunity TODAY! You'll find all the information you need at www.ipc.org/FlexNChips. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------