TECHNET Archives

February 2002

TechNet@IPC.ORG
Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Electroless nickel to electroplated copper separation
From:
Peter Nemcik <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 Feb 2002 05:20:56 -0800
Content-Type:
multipart/alternative
Parts/Attachments:
text/plain (412 bytes) , text/html (490 bytes) 

Can somebody shed some light on possible causes of adhesion problems between electroless nickel and electroplated copper, that occur at random intervals? Analysis of both baths show they are in order, and the nickel plating is not permitted to dry or passivate before going into the copper.

Thanks in advance

Pete



---------------------------------
Do You Yahoo!?
Yahoo! Greetings - Send FREE e-cards for every occasion!

ATOM RSS1 RSS2