T-netter's;
I am looking for a IPC procedure for disconnecting one soldered lead of a SMT component .
(i.e. to lift one lead without damaging the component or the other solder joints)
IPC 7711/21 have procedures for component removal (for example procedure 3.8 J -Lead Removal),
but not a procedure that we need.
Can anyone help?
Thanks in advance for your responses.
Mordechai Kirshenbaum