T-netter's;

I am looking  for a IPC procedure for  disconnecting  one soldered lead of a SMT component .
(i.e. to lift one lead without damaging the component or the other solder joints)
IPC 7711/21 have procedures for component removal (for example  procedure 3.8 J -Lead Removal),
but not a procedure that we need.

Can anyone help?


Thanks in advance for your responses.


Mordechai Kirshenbaum