T-netter's; I am looking for a IPC procedure for disconnecting one soldered lead of a SMT component . (i.e. to lift one lead without damaging the component or the other solder joints) IPC 7711/21 have procedures for component removal (for example procedure 3.8 J -Lead Removal), but not a procedure that we need. Can anyone help? Thanks in advance for your responses. Mordechai Kirshenbaum