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March 2013

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TechNet <[log in to unmask]>
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Date:
Tue, 12 Mar 2013 10:30:18 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Mordechai Kirshenbaum <[log in to unmask]>
Subject:
IPC procedure for disconnecting one soldered lead of a SMT component
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Mordechai Kirshenbaum <[log in to unmask]>
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T-netter's;

I am looking  for a IPC procedure for  disconnecting  one soldered lead of a SMT component .
(i.e. to lift one lead without damaging the component or the other solder joints)
IPC 7711/21 have procedures for component removal (for example  procedure 3.8 J -Lead Removal),
but not a procedure that we need.

Can anyone help?


Thanks in advance for your responses.


Mordechai Kirshenbaum

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