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October 2001

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Subject:
Re: BGA Component Baking - Plastic Body
From:
Phil Zarrow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 26 Oct 2001 00:22:14 EDT
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Peter and all -
Actually, the IPC/Jedec spec scratches the surface - MSD is more involved
than most practitioners know about.
I highly recommend some excellent papers, including one by Dr. Schook of ATT
who seems to be the MSD whiz at the Cogiscan website.  The Cogiscan people
are MSD gurus.  They are at www.cogiscan.com
Phil Zarrow
ITM Consulting
Durham, NH  USA
www.ITM-SMT.com

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