Jeff said in his message that they baked the part, reballed the part and
directly placed it in a dry box. IMHO they will be safe. You are correct. If
they let the material set on the shop floor for two man days before they
complete rework they may have trouble . . . they know better than that.
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of <Peter George Duncan>
> Sent: Friday, October 26, 2001 4:08 AM
> To: [log in to unmask]
> Subject: Re: [TN] BGA Component Baking - Plastic Body
>
>
> Guy,
>
> I am a bit concerned about your suggestion about not baking the BGA's
> without knowing what their exposure time is. If they haven't been
> monitored, or have been out of a dry cabinet for 16 hours or more in total
> since previous bake or since removal from their original barrier
> bags, it's
> safer to bake them after re-balling them. This is to minimise the risk of
> delamination or popcorning when they placed back on the boards and
> subjected to reflow.
>
> I think you're right that both J-STD-20 and J-STD-33 are free downloads
> from the IPC site.
>
> Peter Duncan
>
>
>
>
>
> Guy Ramsey
> <gramsey@ACIU To: [log in to unmask]
> SA.ORG> cc: (bcc: DUNCAN
> Peter/Asst Prin Engr/ST
> Sent by: Aero/ST Group)
> TechNet Subject: Re: [TN]
> BGA Component Baking -
> <[log in to unmask] Plastic Body
> ORG>
>
>
> 10/26/01
> 04:27 AM
> Please
> respond to
> "TechNet
> E-Mail
> Forum."
>
>
>
>
>
>
> We would not bake the parts again, after reballing, sounds like
> you will be
> meeting the requirments of the standard. I think it is a free download. If
> you need the link let me know and I will try to find it. Might
> have been on
> the ANSI page or JEDEC.
>
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]]On Behalf Of Jeff Ferry
> > Sent: Thursday, October 25, 2001 9:45 AM
> > To: [log in to unmask]
> > Subject: [TN] BGA Component Baking - Plastic Body
> >
> >
> > BGA Guru's,
> >
> > We're doing a big project that requires removal/replacement of several
> > hundred plastic BGA components. After removal we'll be reballing the
> BGA's
> > and then reinstalling them. These are new builds, they're not
> coming back
> > from the field.
> >
> > Who knows what J-STD-20, or any other reference, says about prebaking
> > temp/time to eliminate possible moisture problems in the components or
> > boards prior to initial removal? Removed parts will be stored in a
> > desiccant chamber before and after reballing. Do we need to bake these
> > parts again prior to installation? Do ya'all normally bake new
> > build boards
> > in this situation?
> >
> > Thanks for you recommendations.
> >
> > Jeff Ferry
> > CEO
> > Circuit Technology Center, Inc.
> >
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