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I'm looking for a thermal adhesive to use between a component and PWB for
thermal transfer. Properties should be close to the following:
Lap shear 500 psi
thermal conductivity 4.50 BTU... FT2 (.0065 WATTS/CM C)
The material must also meet the fungus and non-nutrient requirements of
MIL-STD-454 Requirement 4. Reworkability is also a requirement... something
like a one part silicon-based adhesive would be nice.
Thanks
Jim Marsico
(516) 595-5879
[log in to unmask]
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