I'm looking for a thermal adhesive to use between a component and PWB for thermal transfer. Properties should be close to the following: Lap shear 500 psi thermal conductivity 4.50 BTU... FT2 (.0065 WATTS/CM C) The material must also meet the fungus and non-nutrient requirements of MIL-STD-454 Requirement 4. Reworkability is also a requirement... something like a one part silicon-based adhesive would be nice. Thanks Jim Marsico (516) 595-5879 [log in to unmask] ******************************** * ______ _ _ _____ * * / ___ | | | | | _____ * * / /___| | | | | | _____ * * __/ ____ | | | | |______ * * |____/ |_| |_| |________| * * * * SYSTEMS, INC. * ******************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************