Hello TechNet experts,
At the wave soldering process, the solder filling of thermal vias(the via
holes connected with copper plane by thermal pad) can not fulfill the 75%
acceptance spec in IPC-610D. Moreover, at the lead free wave soldering
process, the wetting contact angles of thermal pads exceed 90กใ often.
My question is how to improve solder filling and wetting contact angles
for thermal via holes? Thanks a lot.
Best Regards
Charming Chan
PCBA Engineer
--------------------------------------------------------
ZTE Information Security Notice: The information contained in this mail is solely property of the sender's organization. This mail communication is confidential. Recipients named above are obligated to maintain secrecy and are not permitted to disclose the contents of this communication to others.
This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the originator of the message. Any views expressed in this message are those of the individual sender.
This message has been scanned for viruses and Spam by ZTE Anti-Spam system.