Hello,
Based on my literature research, my preliminary plans would be:
1. Obtain SIR comb pattern coupons, run them through the assembly
process w/o components. Use interested flux and solder wire, reflow.
2. SIR test OR
1. Run the product board through the assembly process w/o components.
Use interested flux and solder wire, reflow.
2. Ionic test like Omagemeter
Definitely, the second plan is simpler for us. But I am not sure it
can work. Could someone provide some advices on a simple workable
qualification procedure for no-clean rework?
Another related question:
I am aware of 2 options to make test coupons: one is to get coupons;
the other is to get Gerber file of the test pattern and generate it on
the product board. Which one is better?
Appreciate any help.
Regards,
Yuan