Hello, Based on my literature research, my preliminary plans would be: 1. Obtain SIR comb pattern coupons, run them through the assembly process w/o components. Use interested flux and solder wire, reflow. 2. SIR test OR 1. Run the product board through the assembly process w/o components. Use interested flux and solder wire, reflow. 2. Ionic test like Omagemeter Definitely, the second plan is simpler for us. But I am not sure it can work. Could someone provide some advices on a simple workable qualification procedure for no-clean rework? Another related question: I am aware of 2 options to make test coupons: one is to get coupons; the other is to get Gerber file of the test pattern and generate it on the product board. Which one is better? Appreciate any help. Regards, Yuan