We recently tried an OSP (Entek Plus CU106A) on one of our new designs.
The board contains fine pitch
surface mount and thru-hole.  Both our PCB manufacturer and assembly house
have dealt with OSP's in the past.
When we received the assembled boards back from our assembly house we
noticed that the solder did not fully
cover various pads.  The assembly house said that they opened up the
aperture on the stencil to allow sufficient
solder paste to be deposited to cover the entire pad.

The solder joints look excellent.  Our assembly house says that there must
have been contaminants in the processing
of the OSP coating at the PCB manufacturing house.  As of yet I have not
received a response from our PCB board house.
Has anyone heard of this situation?  If the PCB vendor comes back and says
the problem is not on their end who should
I believe?  Thank you in advance.

Mike Forrester
LeCroy Corp.
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