We recently tried an OSP (Entek Plus CU106A) on one of our new designs. The board contains fine pitch surface mount and thru-hole. Both our PCB manufacturer and assembly house have dealt with OSP's in the past. When we received the assembled boards back from our assembly house we noticed that the solder did not fully cover various pads. The assembly house said that they opened up the aperture on the stencil to allow sufficient solder paste to be deposited to cover the entire pad. The solder joints look excellent. Our assembly house says that there must have been contaminants in the processing of the OSP coating at the PCB manufacturing house. As of yet I have not received a response from our PCB board house. Has anyone heard of this situation? If the PCB vendor comes back and says the problem is not on their end who should I believe? Thank you in advance. Mike Forrester LeCroy Corp. [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************