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SIGN OFF TechNet
-----Original Message-----
From: Automatic digest processor [mailto:[log in to unmask]]
Sent: Wednesday, July 07, 1999 11:00 PM
To: Recipients of TechNet digests
Subject: TechNet Digest - 6 Jul 1999 to 7 Jul 1999 (#1999-16)
There are 16 messages totalling 733 lines in this issue.
Topics of the day:
1. AMRC 1997 report
2. Prepregs
3. "Solderability Testing" In Use
4. AW: [TN] adhesive to solder mask adherence issue
5. J-STD-003, Sect. 1.8, Coating Durability
6. IPC Makes Lead Free Technical Papers Available for Free Download
7. PEM's in PWB's
8. Magnet wire insulation criteria
9. [LF] "Drop-In" Replacement (2)
10. Cu thickness varies from panel to panel
11. SIGN OFF (2)
12. Conformal Coating (2)
13. R-Pak Wavesolder Footprint
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