SIGN OFF TechNet -----Original Message----- From: Automatic digest processor [mailto:[log in to unmask]] Sent: Wednesday, July 07, 1999 11:00 PM To: Recipients of TechNet digests Subject: TechNet Digest - 6 Jul 1999 to 7 Jul 1999 (#1999-16) There are 16 messages totalling 733 lines in this issue. Topics of the day: 1. AMRC 1997 report 2. Prepregs 3. "Solderability Testing" In Use 4. AW: [TN] adhesive to solder mask adherence issue 5. J-STD-003, Sect. 1.8, Coating Durability 6. IPC Makes Lead Free Technical Papers Available for Free Download 7. PEM's in PWB's 8. Magnet wire insulation criteria 9. [LF] "Drop-In" Replacement (2) 10. Cu thickness varies from panel to panel 11. SIGN OFF (2) 12. Conformal Coating (2) 13. R-Pak Wavesolder Footprint