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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 9 Jan 2002 15:41:40 -0000 |
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Doug,
I wrote a review of the wire tacking process, which might assist you in your
research - http://www.intertronics.co.uk/articles/tb003.htm. Component
staking has slightly different requirements - a large blob underneath a
component may raise further CTE related questions.
Regards,
Peter
--
=========================================================
Peter Swanson [log in to unmask]
INTERTRONICS http://www.intertronics.co.uk
INTERTRONICS is dedicated to providing quality material,
consumable and equipment solutions to the electronics
manufacturing and other technology based industries, with
the highest levels of technical support and customer
service.
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 07 January 2002 19:41
To: [log in to unmask]
Subject: [TN] Staking compounds
Good day all,
I am curious as to what all y'all use for staking compounds (to fix wires
or components in place) on your assemblies, especially if you are in the
high-rel area or aerospace sector. Thanks.
Doug Pauls
Rockwell Collins
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