Doug,

I wrote a review of the wire tacking process, which might assist you in your
research - http://www.intertronics.co.uk/articles/tb003.htm. Component
staking has slightly different requirements - a large blob underneath a
component may raise further CTE related questions.

Regards,
Peter
--
=========================================================
Peter Swanson            [log in to unmask]
INTERTRONICS                http://www.intertronics.co.uk

INTERTRONICS is dedicated to providing quality material,
  consumable and equipment solutions to the electronics
manufacturing and other technology based industries, with
   the highest levels of technical support and customer
                         service.


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 07 January 2002 19:41
To: [log in to unmask]
Subject: [TN] Staking compounds


Good day all,

I am curious as to what all y'all use for staking compounds (to fix wires
or components in place) on your assemblies, especially if you are in the
high-rel area or aerospace sector.  Thanks.

Doug Pauls
Rockwell Collins

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