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Wed, 19 Sep 2012 18:45:58 +0300 |
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I found a good article which should explain much:
http://www.smtnet.com/library/files/upload/Reliability_and_Failure_Mechanism
s.pdf
By the way: personal news:
Since last week I resumed my work as Technology Laboratory Manager in
Sanmina-SCI Israel, and am now a happy retiree .
I will follow our TechNet constantly, but now only for fun....
Gaby
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: ד 19 ספטמבר 2012 03:38
To: [log in to unmask]
Subject: [TN] Broken Vias
Hi,
This is a follow up on the broken vias on a board with plugged and plated
through vias.
The laminate is 370HR (Tg 180) and the fill material is PHP-900 IR-6P from
San-Ei Kagaku (Tg 168).
I do not have cross section pictures yet.
If anyone has any ideas on how these material might react to a lead free
reflow process and via barrels would be broken please let me know. I am
interested in any and all ideas.
Bob K.
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