I found a good article which should explain much: http://www.smtnet.com/library/files/upload/Reliability_and_Failure_Mechanism s.pdf By the way: personal news: Since last week I resumed my work as Technology Laboratory Manager in Sanmina-SCI Israel, and am now a happy retiree . I will follow our TechNet constantly, but now only for fun.... Gaby -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner Sent: ד 19 ספטמבר 2012 03:38 To: [log in to unmask] Subject: [TN] Broken Vias Hi, This is a follow up on the broken vias on a board with plugged and plated through vias. The laminate is 370HR (Tg 180) and the fill material is PHP-900 IR-6P from San-Ei Kagaku (Tg 168). I do not have cross section pictures yet. If anyone has any ideas on how these material might react to a lead free reflow process and via barrels would be broken please let me know. I am interested in any and all ideas. Bob K. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ __________ Information from ESET NOD32 Antivirus, version of virus signature database 7495 (20120919) __________ The message was checked by ESET NOD32 Antivirus. http://www.eset.com __________ Information from ESET NOD32 Antivirus, version of virus signature database 7495 (20120919) __________ The message was checked by ESET NOD32 Antivirus. http://www.eset.com ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________