Howdy,

     I understand that the paste height of one mil or more above the stencil 
thickness is quite common.  Controlling the paste height is a good way to 
monitor screen printing process. However, it's imperative to review the 
correlation between your defect data vs paste height to determine your SPC 
target. Keep in mind that the following factors can also affect the screen 
printing process yield:

     - board warp**
     - aperture design
     - board support**
     - printing parameters  (Snap off)**
     - solder mask**
     - surface finish**
     - squeegee type**
     - print locations**
     - footprint design
     - stencil thickness**
     etc....

Note: ** affect Paste height

Hope this helps
Michael Yuen


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